Customization: | Available |
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Usage: | Signal Jammer |
Type: | Wireless |
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6GHz-8GHz-500W power amplifier
Technical Parameter Requirements | Working Frequency | 6000~8000MHz | ||
Modulation System | ASK,BPSK | |||
Output Power | ≥15dBm(25ºC Test) | |||
Function | RS422 serial communication, with current detection and open circuit protection | |||
Power Supply | DC+40V | |||
Interface | A total of 3 locations, 1 RF interface (internal DC isolation), 2 power interfaces and control locations | |||
Shape and Appearance Requirements | Dimensions: 120mm×100mm×25mm, bottom surface (heat dissipation surface) roughness less than 3.2mm, mounting surface flatness less than 0.15mm. | |||
Labeling Requirements | Methods of Labeling | Laser Inscription | ||
Environmental requirements | Storage Temperature | -20~+60ºC | ||
Operation Temperature | Low Temperature:-10ºC±2ºC; High Temperature:+50ºC±2ºC |
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Technical Parameter Requirements | Working Frequency | 7020~7380MHz | ||
Power Gain | ≥50dB(25ºC Test) | |||
Output Power | ≥57dBm(25ºC Test) | |||
Pulse | Duty cycle 20%; Pulse width 200us; The pulse format can be changed via the host computer. | |||
Function | RS422 serial communication, the module has power detection, temperature detection, current detection, open circuit protection | |||
Power Supply | DC+40V | |||
Interface | 4 in total, 2 RF interfaces (internal DC isolation), 2 power interfaces and controls | |||
Shape and Appearance Requirements | Dimensions: 200mm×150mm×25mm, bottom surface (heat dissipation surface) roughness less than 3.2mm, mounting surface flatness less than 0.15mm. | |||
The module should be assembled on a cold plate for use, with good heat dissipation; Its bottom surface is the surface for heat conduction. | ||||
Labeling Requirements | Methods of Labeling | Laser Inscription | ||
Environmental Temperatures | Storage Temperature | -20~+60ºC | ||
Operation Temperature | Low Temperature:-10ºC±2ºC; High Temperature:+50ºC±2ºC |
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