GaN RF Power Transistors 8.5-9.7GHz Communication Chip Module

Product Details
Customization: Available
Frequency Range: 8.5-9.7GHz
Frequency: 8.5-9.7GHz
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  • GaN RF Power Transistors 8.5-9.7GHz Communication Chip Module
  • GaN RF Power Transistors 8.5-9.7GHz Communication Chip Module
  • GaN RF Power Transistors 8.5-9.7GHz Communication Chip Module
  • GaN RF Power Transistors 8.5-9.7GHz Communication Chip Module
  • GaN RF Power Transistors 8.5-9.7GHz Communication Chip Module
  • GaN RF Power Transistors 8.5-9.7GHz Communication Chip Module
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  • Overview
  • Product Description
  • Product Features
Overview

Basic Info.

Application
8.5-9.7GHz
Drain-Source Breakdown Voltage
120V
Gate-Source Voltage
-10~+2V
Drain-Source Voltage
0~+40V
Max Forward Gate Current
50.8mA
Storage Temperature
-65~+150ºC
Channel Temperature
225ºC
Transport Package
by Box
Specification
To be customized
Trademark
ZD TECH
Origin
China
HS Code
8543209090
Production Capacity
2000pieces/Month

Product Description

GaN RF Power Transistors 8.5-9.7GHz Communication Chip Module
GaN RF Power Transistors 8.5-9.7GHz Communication Chip Module
Product Description
GaN RF power transistor is a high-power internally matched power transistor, based on GaN devices made with domestically produced materials and processes.It has an available operating frequency range of 8.5~9.7 GHz and can provide optimal power and gain performance in a 50Ω system at saturated power in pulse signal mode.
 
Product Features
1)Covering operating frequency band: 8.5~9.7 GHz
2)50 Ω impedance matching, easy to cascade
3)Typical operating voltage: 28 V
4)100% RF test
5)Excellent thermal stability
6)RoHS compliant

Typical Performance1

Operating frequency
(MHz)
  Output power 2
(dBm)
  Power added efficiency 2
(%)
     Power gain 2
(dB) 
 8500       49.3       27       9.3 
 9100       50.7       40       10.7 
 9700       49.6       36       9.6 

1 Test conditions: VDS = 28 V, IDQ = 1000 mA, pulse width 100 μs, duty cycle 10%, input power Pin = 40 dBm.
2 Test data based on typical application circuit, for reference.
 

Operating frequency
(MHz)
  Output power 3
(dBm)
     Power added efficiency 3
(%) 
     Power gain 3
(dB) 
 8500       51.4       34       8.4 
 9100       51.7       41       8.7 
 9700       50.8       38       7.8 

1 Test conditions: VDS = 28 V, IDQ = 1000 mA, pulse width 100 μs, duty cycle 10%, input power Pin = 43 dBm.
3 Test data based on typical application circuit, for reference.

Limit Parameters

Parameters   Symbol   Value   Unit
Drain-source breakdown voltage   VDSS   120   V
Gate-source voltage   VGS   -10~+2   V
Drain-source voltage   VDS   0~+40   V
Max forward gate current   IGMAX   50.8   mA
Storage temperature   TSTG   -65~+150   ºC
Channel temperature   TCH   225   ºC


Thermal Properties

Parameters   Symbol   Value   Unit
Thermal resistance
 (case temperature 70°C, heat dissipation 85 W)
  Rthjc   TBD   ºC/W


Electrical Properties Table (TA = 25ºC)

Parameters   Symbol   Min value   Typ.l value   Max value   Unit
Drain-source leakage current
(VGS = -10 V, VDS = 120 V)
  IDSS   -   -   50.8   mA
Drain-source breakdown voltage
(VGS = -10 V, ID = 50.8 mA)
  V(BR)DSS    120   -   -   V
Gate threshold voltage
(VDS = 28 V, ID = 50.8 mA)
  VGS(TH)   -4.0   -2.8   -1.0   V
Gate quiescent bias voltage
(VDS = 28 V, ID = 1000 mA)
  VGS(Q)   -   -2.7   -   V


RF Performance (9700 MHz typical performance 1)

Parameters   Symbol   Min. value   Typ. value   Max. value   Unit
Peak output power   Psat   -   TBD   -   dBm
Drain efficiency   ηD   -   TBD   -   %
Power gain   GP   -   TBD   -   dB

1 Based on DE2G8597-150TFA mass production test fixture, test conditions: VDS = 28 V, IDQ = 1000 mA, pulse width 100 μs, duty cycle 10%.

Load Adaptability

Parameters   Results
VSWR 5:1 Operating conditions: VDS = 20 V
150 W pulse power output, pulse width 100 μs,
duty cycle 10%.
  TBD


Package Size
GaN RF Power Transistors 8.5-9.7GHz Communication Chip Module

NO.   Inches   Millimeters
  Min. value   Type.value   Max.value   Min. value   Type.value   Max.value
A   0.17   0.19   0.19   4.42   4.7   4.98
A1   0.05   0.06   0.06   1.3   1.4   1.5
A2   0.08   0.09   0.09   2.15   2.4   2.65
D   0.94   0.94   0.94   23.85   24   24.15
D1   0.8   0.8   0.8   20.25   20.4   20.55
D2   0.63   0.63   0.63   15.95   16.1   16.25
D3   0.62   0.63   0.63   15.87   15.9   15.93
D4   0.02   0.02   0.02   0.55   0.6   0.65
E   0.68   0.69   0.69   17.25   17.4   17.55
E1   0.61   0.62   0.62   15.55   15.7   15.85
E2   0.61   0.61   0.61   15.47   15.5   15.53
E3   0.13   0.14   0.14   3.2   3.5   3.8
E4   0.31   0.31   0.31   7.9   8   8.1
E5   0.1   0.1   0.1   2.5   2.6   2.7
F   0   0   0   0.05   0.1   0.15
R1   0.03   0.04   0.04   0.85   1   1.15
R2   0.04   0.05   0.06   1.10   1.25   1.40


Moisture Sensitivity Level

Test Method   Level
Moisture Sensitivity Level (per J-STD-020)      TBD 


Abbreviation

Abbreviation   Description
GaN   Gallium Nitride
VSWR   Voltage Standing Wave Ratio
TBD   To Be Determined

 

 

GaN RF Power Transistors 8.5-9.7GHz Communication Chip Module

GaN RF Power Transistors 8.5-9.7GHz Communication Chip ModuleGaN RF Power Transistors 8.5-9.7GHz Communication Chip ModuleGaN RF Power Transistors 8.5-9.7GHz Communication Chip ModuleGaN RF Power Transistors 8.5-9.7GHz Communication Chip Module

GaN RF Power Transistors 8.5-9.7GHz Communication Chip Module

 

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