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GaN RF Power Transistor 350W Communication Chip Module

Shenzhen Zd Tech Co., Ltd
  • Audited Supplier
  • 5 yrs

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Product Highlights

  • High Efficiency and Gain: Delivers up to 83% drain efficiency and 25.2 dB gain at 1000 MHz.
  • Wide Frequency Range: Operates effectively from DC to 1.4 GHz with specific performance at 870, 930, and 990 MHz.
  • High Power Output: Provides 350 W saturated power output (Psat) with excellent ruggedness.
  • Advanced GaN Technology: Utilizes first-generation RF GaN HEMT technology for superior performance.
  • RoHS Compliant: Manufactured with lead-free materials ensuring environmental compliance.
  • Robust Reliability: Features excellent ruggedness and reliability for general purpose applications.
  • Flexible Packaging: Available in Tray (20 units) or Tape and Reel (100 units) options.

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Product Images of GaN RF Power Transistor 350W Communication Chip Module

GaN RF Power Transistor 350W Communication Chip Module pictures & photos
GaN RF Power Transistor 350W Communication Chip Module
GaN RF Power Transistor 350W Communication Chip Module pictures & photos
GaN RF Power Transistor 350W Communication Chip Module
GaN RF Power Transistor 350W Communication Chip Module pictures & photos
GaN RF Power Transistor 350W Communication Chip Module
GaN RF Power Transistor 350W Communication Chip Module pictures & photos
GaN RF Power Transistor 350W Communication Chip Module
GaN RF Power Transistor 350W Communication Chip Module pictures & photos
GaN RF Power Transistor 350W Communication Chip Module
GaN RF Power Transistor 350W Communication Chip Module pictures & photos
GaN RF Power Transistor 350W Communication Chip Module
  • GaN RF Power Transistor 350W Communication Chip Module
    GaN RF Power Transistor 350W Communication Chip Module
  • GaN RF Power Transistor 350W Communication Chip Module
    GaN RF Power Transistor 350W Communication Chip Module
  • GaN RF Power Transistor 350W Communication Chip Module
    GaN RF Power Transistor 350W Communication Chip Module
  • GaN RF Power Transistor 350W Communication Chip Module
    GaN RF Power Transistor 350W Communication Chip Module
  • GaN RF Power Transistor 350W Communication Chip Module
    GaN RF Power Transistor 350W Communication Chip Module
  • GaN RF Power Transistor 350W Communication Chip Module
    GaN RF Power Transistor 350W Communication Chip Module

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Product Description

Product Description
ZD-350WGaN is a 350 W RF GaN HEMT Transistor with first generation RF GaN technology fromNX,whichisidealforgeneralpurposeapplicationsatfrequenciesfromDCto1.4GHz.
Freq (MHz)
Psat (dBm)
ηD2 (%)
GP2 (dB)
870
56.2
68.1
18.6
930
55.7
69.5
18.9
990
55.8
67.0
18.2
1 Typical performance in NX Demo with the device soldered onto the heatsink, test condition: VDS = 48 V, IDQ = 250 mA; Input signal Pulsed CW, Pulse width = 350 μs, Duty cycle = 16 %.
2 Measured at Pout = 350 W.
Product Features
1) High efficiency, high gain
2) Excellent ruggedness
3) Excellent reliability
 
Applications
1) Broadbandgeneralpurposeamplifier
2) Testinstrumentation
3) Generalpurposeapplication

Lead-free and RoHS Compliant

GaN RF Power Transistor 350W Communication Chip ModuleGaN RF Power Transistor 350W Communication Chip Module

 
Pinninginformation

GaN RF Power Transistor 350W Communication Chip Module
 

Product Parameters

Ordering Information

Part number
Marking
Package Type
Packaging Information
ZD-350WGaN
ZD-350WGaN
780P2GC
Tray: Suffix = 20 units
Tape and Reel:
Suffix = 100 units;44 mm Tape width;13- inch Reel

 

Maximum ratings

Parameter
Symbol
Rating
Unit
Drain-Source Voltage
VDSS
150
V
Gate-Source Voltage
VGS
-10 ~ +2
V
Operating Voltage
VDS
0 ~ +55
V
Maximum Forward Gate Current
IGMAX
56.1
mA
Storage Temperature Range
TSTG
- 65 ~ +150
ºC
Operating Junction Temperature
TJ
225
ºC
Absolute Maximum Channel Temperature 1
T(MAX)
275
ºC
1 Functional operation above 225ºC has not been characterized and is not implied. Operation at T(MAX) (275ºC) reduces median time to failure by an order of magnitude; Operation beyond T(MAX) could cause permanent damage.

 
Moisture Sensitivity Level
Test Methodology
Class
Moisture Sensitivity Level (per J-STD-020)
Level 1

Electrical characteristics (TA = 25ºC unless otherwise noted)
DC Characteristics
Parameter
Symbol
Min.
Typ.
Max.
Unit
Side A, Carrier
Drain-Source Leakage Current
(VGS = -10 V, VDS = 150 V)
IDSS
- -
28.0
mA
Drain-Source Breakdown Voltage
(VGS = -10 V, ID = 28.0 mA)
V(BR)DSS
150
- -
V
Gate Threshold Voltage
(VDS = 48 V, ID = 28.0 mA)
VGS(th)
-3.9
-3.2
-2.5
V
Gate Quiescent Voltage
(VDS = 48 V, ID = 250 mA)
VGS(Q)
-3.7
-3.0
-2.3
V
Side B, Peaking
Drain-Source Leakage Current
(VGS = -10 V, VDS = 150 V)
IDSS
- -
28.0
mA
Drain-Source Breakdown Voltage
(VGS = -10 V, ID = 28.0 mA)
V(BR)DSS
150
 
-
-
V
Gate Threshold Voltage
(VDS = 48 V, ID = 28.0 mA)
VGS(th)
-3.9
-3.2
-2.5
 
Gate Quiescent Voltage
(VDS = 48 V, ID = 250 mA)
VGS(Q)
-3.7
-3.0
-2.3
V
 
Test Information

Typical Application Circuit
GaN RF Power Transistor 350W Communication Chip Module

List of Components
S/N
Type
Designator
Description
Value
Vendor
1
Cap
C1, C6, C7, C10, C11
ATC600F391JT250XT
39 pF
ATC
2
Cap
C2, C3, C4, C5
GRM31CZ72A225KE
2.2 uF
Murata
4
Cap
C8, C9, C24
ATC600F2R0JT250XT
2.0 pF
ATC
5
Cap
C12, C13, C14, C15
ATC600F3R3JT250XT
3.3 pF
ATC
6
Cap
C16, C17, C18, C19
ATC600F0R9JT250XT
0.9 pF
ATC
7
Cap
C20, C21
GRM31CZ72A106KE
10 uF
Murata
8
Cap
C22
ATC600F2R2JT250XT
2.2 pF
ATC
9
Cap
C23
ATC600F1R5JT250XT
1.5 pF
ATC
10
Cap
C25
ATC600F0R7JT250XT
0.7 pF
ATC
11
Cap
C26
ATC600F681JT250XT
68 pF
ATC
12
Cap
C27
ATC600F1R3JT250XT
1.3 pF
ATC
14
Res
R1, R2, R3
RC1206FR_0791RL
9.1 Ω
Yageo
15
Transistor
T1
ZD-350WGaN
-
NX
16
PCB
 
Rogers 4350B
20 mil
Rogers
 
Pulsed CW
 
GaN RF Power Transistor 350W Communication Chip Module
 

Impedance Information

Typical Impedance of Carrier
Maximum Output Power
Freq (MHz)
ZS (Ω)
ZL (Ω)
GP (dB)
Psat (dBm)
Psat (W)
ηD (%)
1000
1.2 - j7.3
4.2 + j0.4
23.7
54.1
257
70.6
1400
5.3 + j19.6
2.7 + j0.5
22.6
53.6
229
68.7
Maximum Drain Efficiency
Freq (MHz)
ZS (Ω)
ZL (Ω)
GP (dB)
Psat (dBm)
Psat (W)
ηD (%)
1000
1.2 - j7.3
5.9 + j6.0
25.2
51.2
131
83.0
1400
5.3 + j19.6
3.9 + j3.6
23.0
51.5
141
80.9
1 VDS = 48 V, IDQ = 250 mA, Pulsed CW, Pulse width = 100 μs, Duty cycle = 10 %.
 
Typical Impedance of Peak 1
Maximum Output Power
Freq (MHz)
ZS (Ω)
ZL (Ω)
GP (dB)
Psat (dBm)
Psat (W)
ηD (%)
1000
1.2 - j7.3
4.2 + j0.4
23.7
54.1
257
70.6
1400
5.3 + j19.6
2.7 + j0.5
22.6
53.6
229
68.7
Maximum Drain Efficiency
Freq (MHz)
ZS (Ω)
ZL (Ω)
GP (dB)
Psat (dBm)
Psat (W)
ηD (%)
1000
1.2 - j7.3
5.9 + j6.0
25.2
51.2
131
83.0
1400
5.3 + j19.6
3.9 + j3.6
23.0
51.5
141
80.9
1 VDS = 48 V, IDQ = 250 mA, Pulsed CW, Pulse width = 100 μs, Duty cycle = 10 %.

GaN RF Power Transistor 350W Communication Chip Module
Median lifetime
 
GaN RF Power Transistor 350W Communication Chip Module
 
Package Outline
GaN RF Power Transistor 350W Communication Chip Module
DIM
INCH
MILLIMETER
MIN
MAX
MIN
MAX
A1
0.805
0.815
20.45
20.70
A2
0.772
0.788
19.61
20.02
A3
0.153
0.162
3.87
4.13
A4
0.385
0.395
9.77
10.03
B1
0.380
0.390
9.65
9.91
B2
0.365
0.375
9.27
9.53
B3
0.108
0.128
2.75
3.25
C1
0.130
0.170
3.30
4.32
C2
0.035
0.045
0.89
1.14
C3
0.057
0.067
1.45
1.70
C4
0.003
0.006
0.08
0.15
D1
0.040 45° REF
1.02 45° REF
 
Abbreviations
Acronym
Description
CW
Continuous Waveform
ESD
Electro-Static Discharge
GaN
Gallium Nitride
HEMT
High Electron Mobility Transistor
MTTF
Median Time To Failure
VSWR
Voltage Standing Wave Ratio
GaN RF Power Transistor 350W Communication Chip Module

GaN RF Power Transistor 350W Communication Chip ModuleGaN RF Power Transistor 350W Communication Chip ModuleGaN RF Power Transistor 350W Communication Chip ModuleGaN RF Power Transistor 350W Communication Chip Module

GaN RF Power Transistor 350W Communication Chip Module

 

About the Supplier

This supplier has been audited by BV. Verify the report on the official BV website with ID "MIC-ASR232920". Items marked "verified" are certified.

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Shenzhen Zd Tech Co., Ltd
Shenzhen Zd Tech Co., Ltd
Shenzhen Zd Tech Co., Ltd
Shenzhen Zd Tech Co., Ltd
Shenzhen Zd Tech Co., Ltd
Shenzhen Zd Tech Co., Ltd
Shenzhen Zd Tech Co., Ltd
Shenzhen Zd Tech Co., Ltd

About Our Factory & Business Background

Address
2501, Block a, Renheng Mengchuang Plaza, Huilongpu Community, Longcheng Street, Longgang District, Shenzhen, Guangdong, China
Terms of Payment
LC, T/T, D/P, PayPal, Western Union, Small-amount payment
International Commercial Terms(Incoterms)
FOB, EXW, CIF, FAS, DDP, DAP, FCA
Average Lead Time
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Nearest Port
Yantian Port

Our Production Capability & Technical Expertise

Main Products
Power Amplifier Module, Satellite Communication System, Buc, Phased Array Antenna, Microwave Components, Sspa, Tr Module, Df System, Antenna, Radar

Our Industry Experience & Global Business Record

Export Year
2022-07-04
Main Markets
North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe

FAQ

What is the frequency range of this transistor?
The device is ideal for general purpose applications at frequencies from DC to 1.4 GHz, with specific performance data provided for 870 MHz, 930 MHz, and 990 MHz.
What is the maximum power output?
The ZD-350WGaN provides a saturated power output (Psat) of 350 W.
What are the maximum voltage ratings?
The maximum Drain-Source Voltage (VDSS) is 150 V, and the Gate-Source Voltage (VGS) ranges from -10 V to +2 V.
Is this product RoHS compliant?
Yes, the product is lead-free and RoHS compliant.
What packaging options are available?
It is available in a Tray package with 20 units per tray or a Tape and Reel package with 100 units per reel.
What are the typical applications for this module?
It is suitable for broadband general purpose amplifiers, test instrumentation, and general purpose applications.
What is the lead time for this product?
The lead time is within 15 workdays during the off-season and one month during the peak season.

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